Omron Makes Debut At Shanghai Electronics Exhibition in Munich - Intelligent Inspection Empowers Upgrade Of Electronic Manufacturing

From March 25th to 27th, 2026, Omron Automation (China) showcased its "Intelligent Inspection Empowerment" theme at the 2026 Munich Shanghai Electronic Equipment Manufacturing Exhibition (E5 Hall, Booth 5326), focusing on the semiconductor, 5G, FPD and other electronic manufacturing fields, and presenting a full-dimensional intelligent inspection and control solution.
The core highlight of the exhibition was the upgraded high-speed CT type X-ray inspection equipment VT-X750, which comes with 300-layer cutting and full-number online inspection functions. It can accurately detect AI hardware manufacturing pain points such as GPU/CPU high-density solder joints and HIP void soldering, and is suitable for multiple scenarios such as AI servers and automotive electronics. At the same time, Omron demonstrated its self-developed temperature uniformity control technology, which can reduce the temperature deviation of workpieces by more than 70%, providing precise temperature control guarantees for wafer growth, bonding and other semiconductor processes.
In addition, Omron also released the collaborative robot TM30S, with a maximum load capacity of 30kg (upgradable to 35kg), a working radius of 1702mm, and empowering heavy-load scenarios such as logistics and assembly. Recently, Omron updated the SF2030 strategic ESG progress, continuously advancing the three goals of carbon neutrality, digitalization and health care, and driving industrial sustainable development through technological innovation.